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GWQ3GRAM-CJ
Home Product KGD
Overview Advanced Known Good Die (KGD) solutions enable precision-engineered performance for System-in-Package (SiP) and Multi-Chip Package (MCP) designs, delivering compact semiconductor integration.
Specification

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Part NumberGWQ3GRAM-CJ

Density8Gb

Organizationx16

Speed3200Mbps

Voltage1.2V

PackageRDL wafer

Product StatusMP

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